Gate 2003 (2 mark)
Question 1:
An
n- type silicon bar 0.1 cm long and 100µm2
in a cross – sectional area has majority carrier concentration of 5
* 1020/m3
and carrier mobility is 0.13 m2/V-s
at 300 k. If the charge of the electron is 1.6 * 1019
coulomb , then the resistance of the bar is,
a)106
ohm
b)104ohm
c)10-1ohm
d)10-4ohm
Answer : a
Explanation:
σ
= nqµn
=
5 * 1020
* 1.6 * 10-19*
0.13 = 10.4
ρ
= 1σ
= 1 /
10.4
R
= ρlA
= 1*0.1*10-210.4*100*10-12
=106Ω
Question 2.
The
electron concentration in a sample of uniformly doped n – type
silicon at 300 k various linearly from 1017/cm3
at X = 0 to 6 * 1016/cm3
at X = 2µm . Assume a situation that electron are supplied to keep
this concentration gradient constant with time. If electronic charge
is 1.6 * 10-19
coulomb and the diffusion constant Dn
= 35 cm2/
s, the current density in the silicon ,if no electric field is
present ,is
a)zero
b)-1120A/cm2
c)-560A/cm2
d)
+1120A/cm2
Answer : b
Explanation:
Jn
=nqµeE
+Dnqdndx
Here
, E = 0
So,
Jn
=qDndndx
dndx
= 6*1016-10172*10-4
= -2*1020
Jn
=1.6*10-19*35*(-2*1020)
Jn
=-1120A/cm2
Question 3:
Match items in Group
-1 with
items in Group
– 2, mostly
suitable.
Group
–
1
P.LED
Q.Avalanche
photodiode
R.
Tunnel
diode
S.
LASER
Group
-2
1.
Heavy
doping
2.
Coherent
radistion
3.
Spontaneous
emission
4.Current
gain
a)P
– 1 ;Q – 2 ;R – 4 ;S – 3
b)P
– 2 ;Q – 3; R – 1 ;S – 4
c)P
– 3 ;Q – 4 ;R – 1 ;S – 2
d)P
– 2 ;Q – 1 ;R – 4 ;S – 3
Answer : c
Question 4
A
particular green LED emits light of wavelength 5490A°.
The energy band gap of the semiconductor material used there is
(Planck’s constant = 6.626 * 10-34
J-s)
a)2.26eV
b)1.98eV
c)1.17eV
d)0.74eV
Answer : a
Explanation:
Eg
= 1.24λ(μm)
=1.245490*10-4
μm
=2.26eV
Question 5
When the gate – to –source voltage VGS
of a MOSFET with threshold voltage of 400 mV, working in saturation
is 900 mV, the drain current is observed to be 1 mA. Neglecting the
channel width modulation effect and assuming that the MOSFET is
operating at saturation , the drain current for an applied VGS
of 1400 mV is
a)0.5mA
b)2.0mA
c)3.5mA
d)4.0mA
Answer : d
Explanation
ID
= K(VGs -
VT)2
1mA
=K (900-400)2
K
=1mA/V2104*25
When
VGS
= 1400
ID
= K(VGs -
VT)2
=1mA25*
104V2
(1400-400)2V2
=1mA*10025*104*
104
ID
= 4mA
Question 6:
If
P is Passivation ,Q is n – well implant , R is metallization and S
is source/ drain diffusion , then the order in which they are
carried out in standard n – well CMOS fabrication process , is
a)P
–Q –R –S
b)Q
–S –R –P
c)R
–P –S –Q
d)S
–R –Q –P
Answer : b
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